This 2-layer rigid PCB is tailored for high-performance microwave, RF, and radar systems, utilizing Wangling F4BTM350 laminate as the base material. The F4BTM350 material integrates high-dielectric, low-loss nano-ceramics, endowing the PCB with superior electrical and thermal properties. This PCB reliably meets the stringent requirements of high-frequency signal transmission in precision RF applications such as satellite communications and base station antennas.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Wangling F4BTM350 (fiberglass cloth + nano-ceramic filling + polytetrafluoroethylene resin) |
| Board Dimensions | 328mm × 84.08mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 7 mils (space) |
| Minimum Hole Size | 0.4mm |
| Vias | No blind vias; Total vias: 68; Via plating thickness: 20 μm |
| Finished Board Thickness | 3.1mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion gold |
| Silkscreen | White on top layer; No silkscreen on bottom layer |
| Solder Mask | Black on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | F4BTM350 Core | 3.048mm (120 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
F4BTM350 Material Introduction
Wangling's F4BTM350 laminates are manufactured through scientific formulation of fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. Based on the F4BM dielectric layer, this material incorporates high-dielectric, low-loss nano-ceramics, which significantly enhance its dielectric constant, heat resistance, insulation resistance, and thermal conductivity, while reducing the thermal expansion coefficient and retaining low-loss characteristics.
F4BTM350 and F4BTME350 share the same dielectric layer but differ in copper foil matching: F4BTM350 is paired with ED copper foil, suitable for applications without PIM requirements; F4BTME350 uses reverse-treated (RTF) copper foil, providing excellent PIM performance, more precise line control, and lower conductor loss.
Key Material Features
| Feature | Specification/Description |
| Dielectric Constant (Dk) | 3.5 ± 0.07 at 10GHz |
| Dissipation Factor | 0.0025 at 10GHz |
| Coefficient of Thermal Expansion (CTE) | X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 51 ppm/°C (-55°C to 288°C) |
| Thermal Coefficient of Dk | -60 ppm/°C (-55°C to 150°C) |
| Moisture Absorption | ≤0.05% |
| Flammability Rating | UL-94 V0 |
| Comparative Tracking Index (CTI) | >600V, Grade 0 |
| Copper Foil Matching | Paired with ED copper foil (suitable for non-PIM applications) |
| Surface Finish Advantage | Immersion gold ensures excellent solderability and corrosion resistance |
Core Benefits
Superior High-Frequency Performance: High Dk (3.5±0.07) and low dissipation factor (0.0025 at 10GHz) ensure stable and efficient high-frequency signal transmission.
Excellent Thermal Stability: Low CTE (X:10 ppm/°C, Y:12 ppm/°C) and excellent heat resistance guarantee dimensional stability under thermal cycling.
High Insulation Reliability: CTI >600V (Grade 0) and high insulation resistance enable safe operation in harsh electrical environments.
Low Environmental Sensitivity: Moisture absorption ≤0.05% minimizes performance degradation in humid conditions.
Safe & Compliant: UL-94 V0 flammability rating and IPC-Class-2 compliance meet strict industry safety and quality standards.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.
Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.
Typical Applications
Microwave, RF, and Radar Systems
Phase Shifters
Power Dividers, Couplers, Combiners
Feed Networks
Phase-Sensitive Antennas, Phased Array Antennas
Satellite Communications
Base Station Antennas
Summary
Wangling F4BTM350 PCB is a high-performance, reliable solution tailored for precision RF applications. By virtue of the material's excellent electrical-thermal properties, strict quality control, and global supply capability, it effectively meets the demanding requirements of high-frequency signal transmission in microwave, satellite communication, and base station fields, providing customers with a cost-effective and trustworthy PCB option.
Product Tags:
|
|
F4BTM350 PCB 2L Wangling 120mil Substrate Black Solder Mask Images
|
